Fill has been essential to the successful manufacturing of IC designs for many nodes. Adding non-functional polygons (dummy) to open areas in a layout helps ensure wafer planarity during chemical/mechanical polishing.
Fill solutions become more challenging with each smaller node because manufacturing processes and physical interactions become more sensitive to metal density variations.
SmartFill has functionality that make fill deck creation manageable to meet growing fill requirements and complexities. SmartFill also has functionality for leading edge designers with specialized flows for NET aware fill flow, ECO fill flow, PowerVia flow and PV Ready flow.
Robin Chia-Application Engineering Consultant
Robin Chia has over 18 years of semiconductor & EDA industry experience, most recently as Application Engineering Consultant with Mentor, a Siemens business, utilizing computational lithography to optimize mask data for fabrication of advanced technology nodes. He graduated from National University of Singapore with a Bachelor of Computing Degree (Honours) and Master of Science (Computer Science). Prior to joining Mentor in 2007, he worked for STMicroelectronics as Tapeout Engineer from 2002-2007.
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About Mentor Graphics Corporation
Mentor Graphics Corporation, a Siemens business, is a world leader in electronic hardware and software design solutions, providing products, consulting services, and award-winning support for the world’s most successful electronic, semiconductor, and systems companies. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. Web site: http://www.mentor.com.