The 5G era has arrived, promising to bring more data, more quickly, to a wide array of new devices. But the road to adoption and deployment continues to be challenging as the technology constantly evolves. 5G aims to deliver unparalleled experiences and change the way live and do business, and enable new applications, services, and ecosystems, supporting advances in smart cities, Industry 4.0, Internet of Things, and the automotive sector, among others.
EE Times Asia will be holding a two-hour webinar on 29 September 2021 to provide insights into the latest developments in 5G technology. Speakers from the leading players in the 5G space—Qualcomm, Rohde & Schwarz, Keysight Technologies, Movandi, EdgeQ, Infineon, and SPIL—will share their thoughts and strategies—from the testing challenges, to semiconductor design and packaging, all the way to deployment and new applications and services.
The webinar will highlight the requirements needed, how 5G impacts network and base station design, the state of 5G adoption in Asia, and the key steps moving forward for the successful rollout of the technology in other markets in the region.
|10:00 – 10:05|| Opening
Stephen Las Marias, Editor, EE Times Asia
|10:05 – 10:15||Keynote – How 5G Enables AIoT
Ting Fang Ji, Senior Director, Qualcomm
|10:15 – 10:40|| Session 1 – Testing 5G Devices: Challenges and Solution Strategies
Mahesh Basavaraju, Market Segment Manager, Wireless Communications, Rohde & Schwarz
|10:40 – 11:05||Session 2 – Challenges and Opportunities with 5G mmWave
Mantosh Malhotra, Managing Director, Asia Pacific & Japan, Movandi
|11:05 – 11:30|| Session 3 – Managing 5G Test Supply Chain in Post-COVID Era
Stanley Mo, Asia Pacific RF Industry Market Manager, Keysight
|11:30 – 11:55||Session 4 – Reinventing Wireless Infrastructure with an Elastic, Programmable 5G+AI Base Station on a Chip
Hariprasad Gangadharan, Head, Silicon Engineering, EdgeQ Inc.
|11:55 – 12:15||Session 5 – Advanced SiP for mmWave Antenna in Package
Dr. Yu-Po Wang, Senior Director, Corporate R&D Center, SPIL (ASE Group)
|12:15 – 12:20||Ending
Stephen Las Marias, Editor, EE Times Asia
Session 1 – Testing 5G Devices: Challenges and Solution Strategies
Despite the pandemic, 5G deployments and uptake have been significantly faster compared to LTE. With each new 3GPP release, 5G is getting feature rich and is compelling to both the device manufacturers and the vertical industries to adopt 5G in their digital transformation journey. We, at Rohde & Schwarz understands the test challenges across the product life cycle and we are here share our innovative solutions to help you bring your products faster to market.
Session 2 – Challenges and Opportunities with 5G mmWave
5G is beginning to deploy rapidly, but in order to truly achieve the ambitious goals of low latency, high bandwidth, greater availability, faster speeds, and consistent coverage — there are unique challenges that must be overcome. Movandi is bringing revolutionary technology to 5G millimeter waves networks. Not only powering 5G infrastructure, but powering 5G mmWave networks indoors, outdoors and in stadiums and venues to ensure that 5G millimeter wave technology can be broadly deployed in real-world scenarios building the “interface of the internet.” Movandi powered smart repeaters deliver unmatched performance, cost and size advantages across challenging high frequency millimeter waves, unlocking the potential of 5G and other multi-gigabit communication applications. Movandi powered smart repeaters deliver ~40% reduction in CAPEX, OPEX and deployment times allowing more 5G coverage, broad application support, rapid roll-out and higher ROI.
Session 3 – Managing 5G Test Supply Chain in Post-COVID Era
Keysight survey link: https://www.research.net/r/SAPKeysight5G
COVID-19 is accelerating 5G technology adoption and commercialization. Various industries like telco and chipmakers are adapting quickly to this trend but also continue to face new test challenges. In the past effects that could be ignored at lower frequencies are now crucial. Performing high-volume test of 5G RF chips required more consideration, not only from technical aspects, but also on intermittent disruptions – how would you do if engineers and supply chain are constantly disrupted by the outbreak? Learn about the new 5G test consideration in the Post-COVID era.
Session 4 – Reinventing Wireless Infrastructure with an Elastic, Programmable 5G+AI Base Station on a Chip
As 5G becomes the lingua franca of connectivity, edge demands will impact the fluidity and constructs of 5G infrastructure. This talk will cover the starting point of all wireless infrastructure – the baseband SoC. We will highlight design advantages of software programmability vs. hardware acceleration. We will cover how a programmable 5G SoC can scale with evolving infrastructural demands across small cells and RU/DU base stations, with virtualized layers of the cellular stack.
Session 5 – Advanced SiP for mmWave Antenna in Package
Tingfang Ji, Senior Director, Engineering/ Qualcomm Technologies, Inc.
Tingfang Ji jointed Qualcomm in 2003 and is currently a senior director of engineering in Wireless R&D. From 2003 to 2014, he made instrumental technical contributions towards the development of LTE and LTE-Advanced technology and served as a vice chairman of the radio working group (RAN4) of 3GPP. Since 2014 he has been responsible for the systems group and later all engineer groups of the first Qualcomm 5G research project, which is the main research engine behind Qualcomm’s 5G NR air interface design/standardization efforts, sub6 GHz multi-vendor pre-commercial 5G NR IODT/trials, and the 5G use cases/technologies experimental macro networks. Before joining Qualcomm, Tingfang was a member of the technical staff at Bell Labs. As an inventor, he has more than 800 US patent applications.
Tingfang received his Ph.D degree in E.E. from the University of Michigan, Ann Arbor in 2001, and also holds a B.Sc. from Tsinghua University.
Mahesh Basavaraju, Market Segment Manager, Wireless Communications/ Rohde & Schwarz
Mahesh Basavaraju is a Market Segment Manager for the Wireless Communication segment at Rohde & Schwarz. He has extensive experience of over 15 years of T&M and now focuses on both cellular and non-cellular technologies in the wireless industry.
Mantosh Malhotra, Managing Director, Asia Pacific & Japan/ Movandi
Mantosh Malhotra is Industry executive and thought leader with extensive experience in the technology, media, and telecom (TMT) sector. His professional focus is on driving industry ecosystems within the TMT industry and has worked with C-level stakeholders across Asia Pacific. Mantosh is the Managing Director, Asia Pacific and Japan for Movandi. With a career spanning over 20 years throughout the Asia Pacific region, Mantosh brings passion towards technology and a wealth of experience in management, business development and engineering. He has consulted clients to evaluate and deploy various technologies within the TMT ecosystem. His efforts have resulted in mass adoption of cellular technology across emerging markets in Asia Pacific.
Stanley Mo, Asia Pacific RF Industry Market Manager/ Keysight
Stanley Mo is the RF and mmWave technologies marketing lead in Asia Pacific. With the extensive knowledge of local Japan and Korea 5G semiconductor development, he hope to leverage this for next South East Asia 5G supply chain upgrade support. Prior to this role, he is responsible to plan and develop 5G and defence marketing programs, with 16 years’ experience in RF test solutions. He received Bachelor’s Degree in Electronic Engineering from Liverpool John Moore University.
Hariprasad Gangadharan/ EdgeQ
Hari has 25 years of communications experience and modem development having worked at Qualcomm, Intel, Broadcom/Beceem, and Cypress. At EdgeQ, Hari leads all facets of design, architecture, systems, IP and implementation.
Dr. YP Wang, Senior Director, Corporate R&D/ SPIL (ASE Group)
Dr. Yu-Po Wang is currently Senior Director of Corporate R&D Center at SPIL, leading the R&D Advanced Packaging design team for the development of wafer form packages, leadframe and substrate. Dr. Wang has more than 20 years of research and manufacturing experience in the field of packaging characterization, including thermal/electrical simulation, co-development design of advanced material, design and advanced packaging development. Dr. Wang owned 83 patents in US and received a Ph.D. degree in Mechanical Engineering from Binghamton University, State University of New York, U.S.A.
More About the Partner Companies
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
Rohde & Schwarz
The Rohde & Schwarz technology group is among the trailblazers when it comes to paving the way for a safer and connected world with its leading solutions in test & measurement, technology systems, and networks & cybersecurity. Founded more than 85 years ago, the group is a reliable partner for industry and government customers around the globe with approximately 12,300 employees.
For more information, visit: http://www.rohde-schwarz.com
Movandi is a 5G mmWave solutions company focused on the design and development of deep semiconductor technology powering 5G and beyond interconnecting our world and enabling AI applications across multiple industries. The company was founded by former Broadcom innovators who are RF and SoC world-recognized pioneers and visionaries, whose innovations have shaped and transformed wireless in the last few decades. Having pioneered wireless RF systems, Movandi is solving real-world 5G mmWave deployments with unmatched differentiation and high-performance core 5G technology in RF, IP and unique engineering methodology that enables service providers and industry partners to launch indoor, outdoor and mobile enhanced 5G mmWave services at 40% lower costs.
For more information, visit: https://movandi.com/
Keysight survey link: https://www.research.net/r/SAPKeysight5G
Keysight Technologies Inc. (NYSE: KEYS) is the world’s leading electronic measurement company, transforming today’s measurement experience through innovations in wireless, modular, and software solutions. With its Hewlett-Packard and Agilent legacy, Keysight delivers solutions in wireless communications, aerospace and defense and semiconductor markets with world-class platforms, software and consistent measurement science.
The company’s nearly 12,600 employees serve customers in more than 100 countries. Keysight’s singular focus on measurement helps scientists, researchers and engineers address their toughest challenges with precision and confidence. With the help of our products and services, they are better able to deliver the breakthroughs that make a measurable difference.
For more information, visit: https://www.keysight.com
EdgeQ is a leading innovator creating the industry’s first 5G Base-Station-on-a-Chip. Led by seasoned executives who have delivered industry-transforming technologies (4G/5G, WiFi, Wimax, Artificial Intelligence, Cloud Servers), EdgeQ is inventing a new paradigm within the wireless infrastructure industry.
For more information, visit: https://edgeq.io/
SPIL (ASE Group)
Established in May 1984, SPIL is dedicated to meeting all customer’s IC packaging and testing requirements. From Wafer Bumping, Wafer Testing, Assembly, Final Test to shipment, SPIL constantly to meet the demand for the most advanced manufacturing technology and also build a strong reputation for high quality products and services.
In 2018, ASE Technology Holding Co., Ltd. is jointly established by the combination of ASE, SPIL and USI. ASE Technology Holding is the leading provider of semiconductor manufacturing services in assembly and test, provides the innovative Advanced Packaging and System-in-Package (SiP) solutions with highly efficient turnkey service platform. Our main manufacturing facilities and sales services are located in many cities in Asia, America, Europe and Africa, with over 100,000 Employees.