TSMC lifted the veil on a 4nm node, previously unannounced manufacturing process.
Taiwan Semiconductor Manufacturing Co. (TSMC) lifted the veil on a previously unannounced manufacturing process between the 5nm and 3nm nodes that are already on the company’s roadmap. It’s 4nm.
“N4 is an evolution from N5,” TSMC Chairman Mark Liu told EE Times at a press event in Hsinchu, Taiwan. “We’re already in business negotiations with customers on N4.”
Liu affirmed information that people working inside a TSMC fab disclosed earlier to EE Times.
The world’s biggest foundry is plugging the gaps against Samsung, its only competitor in the sub-7nm space.
Samsung may start production of its 3nm node in 2022, according to some press reports. Samsung is investing $116 billion to build a 5nm wafer fab in Pyeongtaek, south of Seoul, as it seeks to take global market share from TSMC in the wafer foundry industry.
TSMC’s N5 node that’s already in production will be followed by N5P and N4, three nodes that are part of one set in terms of production capacity. TSMC plans to launch N5P in 2022, followed by N4 in 2023, Liu said.
TSMC Chairman Mark Liu at Hsinchu, Taiwan press conference today. (Image: Alan Patterson, EE Times)
TSMC declined to provide additional information on N4 because the news leaked out before the company had a chance to prepare a formal press release.