Winbond is adding new wafer capacity in its fab in Kaohsiung, Taiwan, starting from the fourth quarter of this year.
Winbond and Infineon are expanding their HYPERRAM product collaboration with the new higher bandwidth HYPERRAM 3.0.
Winbond's W25Q64NE 1.2V SpiFlash NOR flash IC offers the large code storage capacity and active mode power savings needed by…
The global supply of DDR3 solutions is expected to undergo an impending decline, according to TrendForce.
The challenge is adding that memory density without increasing the cost of the device or system too much.
The successful interoperability of Synopsys' DesignWare IP and Winbond's OctalNAND Flash Memory has delivered a complete high-density NAND flash memory…