2017-03-24 - Micha Perlman

AOI, R2R boost flex circuit viability

Automated optical inspection and direct imaging are ensuring higher yields for flexible circuit makers.

2017-03-17 - Rohde & Schwarz

9GHz modular probe analyses data rates up to 5Gbps

The R&S RT-ZM probe offers 9GHz bandwidth, DC offset range of ±16V and MultiMode function to switch between test modes…

2017-03-09 - Bill Schweber

Testing crimp connections the NASA way

NASA has come up with a real-time, ultrasound-based device that sends an acoustic wave through the crimp assembly as it…

2017-03-06 - Rick Merritt

Review system inspects mask at EUV level

Inspections of up to 14nm mask defects or a detector supporting 2,000Hz frame rate are just two uphill tests to…

2017-03-06 - Rick Merritt

Manufacturers pick EUV combos

Co-optimisation tools are now becoming mainstream to help translate between different worlds of chip designers and lithographers.

2017-03-06 - Rick Merritt

EUV lithography scanner aims to produce 104 wafers/h

The ASML NXE:3400B EUV lithography scanner runs at 148W to produce 104 wafers/h, capable of creating overlays within a 3nm…

2017-03-02 - Harman

Vibration analytics-based system predicts IIoT faults

The Harman Quick Predict is an end-to-end warning solution for industrial Internet of Things based on vibration analytical algorithm.

2017-03-01 - Julien Happich

Multi-core parallel engine powers Cadence simulator

The Xcelium Parallel Simulator speeds runtime by an average of 3X for register-transfer level design simulation.

2017-02-06 - ZTE

ZTE achieves deep learning benchmark via Intel FPGA

ZTE achieves a record–beyond a thousand images per second in facial recognition–known as “theoretical high accuracy” for its custom topology.

2017-01-24 - Synopsys

Coverity 8.7 boosts analysis for mobile, web apps

Coverity tool’s 8.7 version expands and enhances analysis via plugins with IDEs like Android Studio, Microsoft Visual Studio, IntelliJ and…