Siemens mPower Digital Solution Now Certified for GlobalFoundries’ Platforms
Siemens' new mPower Digital solution for power integrity analysis of analog, digital and mixed-signal IC designs is now certified for…
Siemens’ AFS Platform Now Certified for UMC’s 28nm HPCᵁ+ Process Technology
Customers using Siemens' AFS platform can now leverage the performance enhancement and power efficiency of UMC's 28HPCᵁ+ process for their…
Securing the Future with Trusted Traceability and Blockchain
The world runs on semiconductors. But semiconductors run on trust.
Siemens Joins Intel Foundry Services’ EDA Alliance Program
As part of the alliance, Siemens plans to collaborate closely with IFS to optimize best-in-class IC design tools, flows and…
Siemens and UMC Partner on Design Kits for Automotive, Power Applications
Siemens has collaborated with UMC to develop process design kits (PDKs) for the foundry's 110nm and 180nm BCD technology platforms.
Siemens mPower Solution Now Certified for TSMC’s N7 and N5 Nodes
Siemens' mPower solution for power integrity analysis of analog, digital and mixed-signal IC designs is now certified for TSMC’s N7…
Siemens Partners with PDF Solutions to Boost IC Yield, Speed Time to Market
Siemens is collaborating with PDF Solutions to transform IC test and yield analysis data from Tessent into actionable intelligence.
LG Energy and Siemens Partner on Battery Manufacturing Intelligence
LG Energy and Siemens are collaborating in the digitization of production processes in battery manufacturing.
Siemens Bags Three TSMC OIP Partner of the Year Awards for Next-gen Design Enablement
Siemens has been recognized by TSMC as a recipient of three 2021 OIP Partner of the Year awards.
Siemens’ Aprisa Now Certified for GlobalFoundries’ 22FDX Platform
Siemens' Aprisa place-and-route solution has now been certified for GlobalFoundries’ 22FDX platform.
Digi-Key Inks Distribution Agreement with Siemens
Digi-Key now distributes Siemens' leading automation and control products.
New JEDEC Industry Standard for Electronics Cooling Simulation
Proposed through the JEDEC JC15 committee, the new JEDEC JEP181 standard simplifies thermal model data sharing.
