Power GaN and SiC: Entering a New Era
Yole Développement estimated a general view of wide bandgap materials such as Gallium Nitride and Silicon Carbide...
New Silicon Carbide Power Module for Electric Vehicles
Infineon demonstrated the EasyPACK module with CoolSiC automotive MOSFET technology...
Chip manufacturer invites to a virtual tour
Infineon Technologies is strengthening its activities in the digitalization of sales and marketing activities. The semiconductor manufacturer is presenting two…
What Does The Future Hold For GaN/SiC?
While silicon still dominates the market, the emergence of Wide-Bandgap devices will soon direct technology toward new, more efficient solutions.
Q&A: Where Is the WBG Market Headed?
GaN Systems says wide bandgap chips will become ubiquitous across a range of industries for several applications...
How SiC FETs Are Changing the Semiconductor Landscape
The current generation of leading SiC devices has changed the face of the semiconductor industry; what sectors will be the…
ST Gears Up SiC Strategy Amid Growing EV Demand
STMicroelectronics has been ramping up its silicon carbide (SiC) capabilities and capacities recently, in anticipation of growing demand from the…
Seeking New Wafer Material for 5G
With 5G, the complexity of RF front-end modules is increasing at a bewildering pace. More antennas, more PAs, more filters…
SMA and Infineon reduce system costs for inverters
Joint press release of SMA Solar Technology AG and Infineon Technologies AG
The Simplicity of Driving CoolSiC™ MOSFETs: A Gate Driving Design Guide
Parasitic turn-on caused by the Miller capacitance is often considered a weak spot of today’s silicon carbide MOSFETs. In order…