Showa Denko has concluded a long-term supply contract with Toshiba to supply SiC epitaxial wafers for power semiconductors.
New silicon carbide (SiC) designs are emerging to meet the growing high-power requirements for electric vehicles.
Applied's new technologies are helping silicon carbide chipmakers transition from 150mm wafer production to 200mm production.
STMicroelectronics expands SiC wafer supply agreement again to over $800 million, and also manufactures first 200mm SiC wafer in-house.
Microchip has expanded its SiC portfolio with a family of high-efficiency, high-reliability 1700V silicon carbide MOSFET die, discrete and power…
STMicroelectronics' transition to 200m wafers marks a milestone in capacity build-up to support automotive and industrial markets.
Infineon Technologies has strengthened its supply security for SiC base material through a supply contract with Showa Denko.
The technical collaboration between ON Semiconductor and Mercedes AMG's High Power Performance (HPP) division has provided technological advances for the…
STMicroelectronics' STGAP2SiCS is optimized for safe control of SiC MOSFETs and operates from a high-voltage rail up to 1.2kV.
UnitedSiC has launched the first four devices based on its Gen 4 SiC FET technology platform. Compared to Gen 3,…