2020-05-25 - SCHURTER

SCHURTER extends PCAP controller portfolio with ILITEK solutions

SCHURTER extends the PCAP controller portfolio with ILITEK further solutions for specific application requirements are available...

2020-04-06 - Junko Yoshida

Seeking New Wafer Material for 5G

With 5G, the complexity of RF front-end modules is increasing at a bewildering pace. More antennas, more PAs, more filters…

2020-03-04 - Chung-Ang University

New Study Finds Graphene Can Prevent the Corrosion of Copper

Scientists in South Korea are first to observe an unprecedented way in which graphene forms a hybrid layer that prevents…

2019-12-31 - Barbara Jorgensen

Tech Companies Sued in Child Labor Lawsuit

A lawsuit brought forward by International Rights Advocates has accused the world’s largest tech companies of knowingly aiding and abetting…

2019-07-18 - Takashi Yunogami

Blog: The Impact of the Japan-Korea Trade War

By restricting exports of key chemical materials to South Korea, Japan has already done irreparable harm to the global electronics…

2019-07-12 - Dylan McGrath

Forecast Worsens for Equipment Market

The equipment market is now forecast to decline by 20% this year. Too much inventory, a trade war, and 5G…

2019-01-31 - Dongguk University

Copper Iodide Enables p-Type Semiconductor Processes

Korean researchers have found a way to create printed p-channel thin-film transistors by using the abundantly available and environmentally-friendly copper(I)…

2019-01-28 - Hailey Lynne McKeefry

Engineered Materials for Aerospace 3D Printing

The aerospace is going to increasingly rely on additive manufacturing technologies. The availability of additive manufacturing effectively create 3D printing…

2019-01-21 - Nitin Dahad

Excitons Pave the Way to Future Electronics

After developing a method to control exciton flows at room temperature, EPFL scientists have discovered new properties of these quasiparticles…

2017-08-16 - Furukawa Electric

Furukawa starts stealth dicing tape production

Stealth dicing tape provides uniform expansion of chips without any external stretching, separating the wafers in perfect condition.