Revenue per Wafer Climbs as Demand Surges for 5nm/7nm IC Processes
Despite high development costs, smaller nodes bring greater revenue per wafer...
ISSCC: Roadmap on 3D Interconnect Density
The common theme coming out of the chiplet forum at ISSCC was the need for a 3D interconnect density roadmap.
Micron Jumps Ahead with 1α Node DRAM
Micron's 1-alpha node DRAM is already in volume production of DDR4 with LPDDR4 in sampling...
ST Establishes “Lab-in-Fab” to Adoption of Piezoelectric MEMS in Singapore
STMicroelectronics establishes first “Lab-in-Fab” to advance adoption of piezoelectric MEMS in Singapore in partnership with A*STAR and ULVAC...
GlobalFoundries Details Ambitious Technology Roadmap
GlobalFoundries discussed its technology roadmap; its plan to invest $1.4B in 2021; its expectation it will achieve profitability; and its…
How Is Intel Part of a “SHIP” Program?
There is nothing new about young men killing themselves through their own stupidity. While tragic, this has been happening since…
Taking a Closer Look at Intel’s Process Roadmap
Somewhat limited improvements of client and server CPUs coupled with delays of new process technologies made Intel look pale. But…
Global DRAM Revenue Rises by 15.4% in 2Q20
DRAM revenue rises by 15.4% in 2Q20, with possible decline in prices expected for 3Q20, says TrendForce...
Selective Tungsten Process Fights Resistance
Chipmakers now have a new manufacturing technology for more precise tungsten contact vias, which lead to performance, power, and area…
New GAA Nanosheet Architecture to Drive Silicon Performance
IBM Research and CEA-Leti show their work on nanosheet architectures to drive the silicon performance needs of HPC applications...