Analog Devices and Gridspertise are collaborating to advance the resiliency and quality of smart grids around the world.
Infineon will launch power semiconductors with CoolSiC MOSFET and .XT technology in the XHP 2 package—tailored specifically to the requirements…
Atomera's quantum engineered thin-film, dubbed MST, is an epitaxially-grown film consisting of a non-semiconductor material such as oxygen inserted into…
Today's wide-bandgap semiconductors, including GaN and SiC, are exceeding the capabilities of traditional silicon-based devices.
The combination of the Renesas GaN boost controller with ultra-efficient eGaN FETs from EPC enables high power density and low-cost…
Zhenghai Group and Rohm will work closely together to pursue technological innovation through the development and widespread use of SiC…
NXP Semiconductors has received six awards for its MCU, IoT cybersecurity IC, power semiconductor, and RF/wireless IC at the inaugural…
The EPC9145 enhances the performance of the motor for range, precision, torque, and eliminates the electrolytic capacitors for lower overall…
With little room left to differentiate smartphones in terms of fit, form, and function, battery life and charging speed have…
Amid the increasing adoption of mobile, IoT and smart devices, ensuring data integrity and safety at all conditions is becoming…
EPC's eGaN FET-based synchronous boost converter achieves 95.3% peak efficiency with low temperature rise with a simple, low-cost topology.
Showa Denko has concluded a long-term supply contract with Toshiba to supply SiC epitaxial wafers for power semiconductors.