Infineon joins charging group for EV standardisation
Infineon aims to provide CharIN its system expertise in electric mobility as well as its automotive safety and data security…
Charger cuts leakage current to 3μA for eCall
The chip’s battery temperature monitoring and 3.6V output voltage helps safeguard and extend the life of LiFePO4 batteries used in…
Power MOSFETs reduce on-resistance per area by 79%
Toshiba’s eight MOSFETs reduce on-resistance per area to house lower Ron chips in the same packages, thus minimising power supply…
Silicon Labs extends IoT portfolio with Zentri buy
With the acquisition, Silicon Labs aims to deliver comprehensive, multiprotocol silicon and software to securely connect IoT products to the…
CEO resignation puts SUNY’s semicon support in doubt
With a missing CEO and disintegration of two projects, SUNY Polytechnic Institute’s commitment to funding research has been put in…
What fuelled 2016 semicon M&As?
The deals’ dollar values in 2015 and 2016 are 8 times greater than the $12.6 billion annual M&A average in…
How important is ISO 26262 training in IC design?
An initial class on the ISO 26262 standard is very beneficial to have before an engineer starts a safety-critical design…
Fully protected power connectors reduce size to 2.5mm
Molex’s Nano-Fit power connectors have multiple colour and mechanical keying options to help designers reduce the risk of cross mating.
TVS diodes secure high-speed interfaces in wearables
The TVS diodes are fabricated with EAP-IV process that utilises Toshiba’s snapback technology for improved system reliability.
High-side switch features on-resistance down to 1.0mΩ
Power Profet switches suit applications with high switching cycles and high energy requirements such as starter relays in “start-stop” systems.
Semtech’s LinkCharge 40 wireless charger delivers 40W
The Semtech’s LinkCharge 40 supports Qi-enabled phones while maintaining small form factor on both ends.
AMP Consortium steps up digital power standards
The group expects to create common configuration files for plug-and-play interoperability to ensure compatibility between each company’s products.
