2021-09-29 - ACN Newswire

Showa Denko Inks Long-Term SiC Wafer Supply Contract with Toshiba

Showa Denko has concluded a long-term supply contract with Toshiba to supply SiC epitaxial wafers for power semiconductors.

2021-09-01 - Stephen Las Marias

ST’s Muggeri Talks Landscape, Road Ahead for SiC and GaN

ST's Francesco Muggeri talks about the role of SiC and GaN in power electronics, their advantages over silicon, and his…

2021-08-31 - RECOM Power GmbH

3D Power Packaging for Low Power DC/DC Converters

DC/DC converter modules have to utilize the Z direction by integrating 3D assembly techniques for the footprint to remain small…

2021-08-27 - STMicroelectronics

STMicroelectronics New MasterGaN Devices Targeted at High-efficiency Power Conversion

STMicroelectronics has released the MasterGaN3 and MasterGaN5 integrated power packages for applications up to 45W and 150W, respectively.

2021-08-27 - Stephen Las Marias

Navitas’ Gene Sheridan Highlights Why GaN Technology for Power Electronics

Navitas Co-Founder and CEO Gene Sheridan talks about the key advantages of using GaN, and how it edges out silicon,…

2021-08-25 - Monolithic Power Systems

How Integration is Advancing Innovations in Power Management

The continuing trend toward smaller and more powerful devices has driven demand for technology that can manage thermals with ever-higher…

2021-07-20 - ACN Newswire

Tanaka Develops Brazing Filler Metal/Copper Composite Material for Power Devices

Tanaka has developed an active brazing filler metal/copper composite material that can be used as next-generation heat sinks for power…

2021-06-01 - Infineon Technologies AG

Samsung Taps Infineon for MOSFET-based Refrigerator Inverter Design

This is Samsung's first refrigerator design that uses discrete devices instead of power modules in the compressor.

2021-01-27 - Maurizio Di Paolo Emilio & Nitin Dahad

AspenCore Book Highlights GaN’s role for the New Power Electronics World

Why Wide BandGap (WBG), and why GaN specifically? AspenCore Media’s “AspenCore Guide to Gallium Nitride: A New Era for Power…

2021-01-08 - Maurizio Di Paolo Emilio

Gen 4 SiC FETs to Achieve Breakthrough Performance

UnitedSiC has launched the first four devices based on its Gen 4 SiC FET technology platform. Compared to Gen 3,…

2020-12-21 - Wise-Integration

Smaller, Faster and more efficient Power Supplies

Wise-Integration announced its WiseGan plateform an integrated 650V GaN half-bridge, in a 6mm x 8mm PQFN package...

2020-11-23 - Digi-Key

Digi-Key Distributes Mag Layers USA MMD Series

Digi-Key Electronics has expanded its product portfolio to include a global distribution of Mag Layers USA MMD series molded power inductors