Showa Denko Inks Long-Term SiC Wafer Supply Contract with Toshiba
Showa Denko has concluded a long-term supply contract with Toshiba to supply SiC epitaxial wafers for power semiconductors.
ST’s Muggeri Talks Landscape, Road Ahead for SiC and GaN
ST's Francesco Muggeri talks about the role of SiC and GaN in power electronics, their advantages over silicon, and his…
3D Power Packaging for Low Power DC/DC Converters
DC/DC converter modules have to utilize the Z direction by integrating 3D assembly techniques for the footprint to remain small…
STMicroelectronics New MasterGaN Devices Targeted at High-efficiency Power Conversion
STMicroelectronics has released the MasterGaN3 and MasterGaN5 integrated power packages for applications up to 45W and 150W, respectively.
Navitas’ Gene Sheridan Highlights Why GaN Technology for Power Electronics
Navitas Co-Founder and CEO Gene Sheridan talks about the key advantages of using GaN, and how it edges out silicon,…
How Integration is Advancing Innovations in Power Management
The continuing trend toward smaller and more powerful devices has driven demand for technology that can manage thermals with ever-higher…
Tanaka Develops Brazing Filler Metal/Copper Composite Material for Power Devices
Tanaka has developed an active brazing filler metal/copper composite material that can be used as next-generation heat sinks for power…
Samsung Taps Infineon for MOSFET-based Refrigerator Inverter Design
This is Samsung's first refrigerator design that uses discrete devices instead of power modules in the compressor.
AspenCore Book Highlights GaN’s role for the New Power Electronics World
Why Wide BandGap (WBG), and why GaN specifically? AspenCore Media’s “AspenCore Guide to Gallium Nitride: A New Era for Power…
Gen 4 SiC FETs to Achieve Breakthrough Performance
UnitedSiC has launched the first four devices based on its Gen 4 SiC FET technology platform. Compared to Gen 3,…
Smaller, Faster and more efficient Power Supplies
Wise-Integration announced its WiseGan plateform an integrated 650V GaN half-bridge, in a 6mm x 8mm PQFN package...
Digi-Key Distributes Mag Layers USA MMD Series
Digi-Key Electronics has expanded its product portfolio to include a global distribution of Mag Layers USA MMD series molded power inductors
