Tanaka Develops Brazing Filler Metal/Copper Composite Material for Power Devices
Tanaka has developed an active brazing filler metal/copper composite material that can be used as next-generation heat sinks for power…
Samsung Taps Infineon for MOSFET-based Refrigerator Inverter Design
This is Samsung's first refrigerator design that uses discrete devices instead of power modules in the compressor.
AspenCore Book Highlights GaN’s role for the New Power Electronics World
Why Wide BandGap (WBG), and why GaN specifically? AspenCore Media’s “AspenCore Guide to Gallium Nitride: A New Era for Power…
Gen 4 SiC FETs to Achieve Breakthrough Performance
UnitedSiC has launched the first four devices based on its Gen 4 SiC FET technology platform. Compared to Gen 3,…
Smaller, Faster and more efficient Power Supplies
Wise-Integration announced its WiseGan plateform an integrated 650V GaN half-bridge, in a 6mm x 8mm PQFN package...
Digi-Key Distributes Mag Layers USA MMD Series
Digi-Key Electronics has expanded its product portfolio to include a global distribution of Mag Layers USA MMD series molded power inductors
Smallest Quad-Output SIMO Power Management IC Achieves 85% Higher Power Density
MAX77655 provides highest number of output channels and cuts solution size by 70 percent for ultra-portable wearables, IoT sensor nodes…
ST Partners with Sanken to Develop IPMs for High-Voltage Designs
ST and Sanken Electric have collaborated to unleash the performance and practical advantages of intelligent power modules (IPM) in high-voltage…
CoolSiC MOSFET MADK Board for Servo Drives Applications
In power electronics motor drives take up a major share in the market...
Still Looking for the Best Approach to Improve Power Efficiency?
Webinar: Advanced Wide-bandgap High-Power Semiconductor Measurement Techniques
Supercapacitors Usurp Battery Technologies
Supercapacitor are still evolving, but the energy storage and charging technology gains adherents...
Motor System ICs for control of small electric motors in cars
Infineon Technologies is presenting a new product family called Motor System ICs designed for control of both brushed and brushless…