2022-05-05 - Xperi Holding Corp.

Xperi and LAPIS Enter into Hybrid Bonding License Agreement

Adeia and LAPIS have signed a technology transfer agreement, which includes the DBI Ultra die-to-wafer hybrid bonding know-how.

2022-05-03 - SEMI

Unisem Wins MEMS Packaging Process Showdown at MEMS & Sensors Technical Congress

Unisem showcased unique designs and effective packaging techniques to meet the needs of a wide range of MEMS and sensors…

2022-04-13 - VeriSilicon

VeriSilicon Joins the UCIe Industry Consortium

VeriSilicon has officially joined the Universal Chiplet Interconnect Express (UCIe) industry consortium.

2022-04-11 - Gary Hilson

Chiplets Get a Formal Standard with UCIe 1.0

The recently announced UCIe 1.0 specification provides a complete standardized die–to–die interconnect with physical layer, protocol stack, software model, and…

2022-01-12 - ACN Newswire

Tanaka Denshi Kogyo to Establish New Plant in China

Tanaka Denshi Kogyo will establish a new plant in Hangzhou, China, for the production of aluminum bonding wires for power…

2021-12-29 - Nepes Laweh Corp.

Nepes Laweh Sets New Industry Benchmark with 600mm Large Panel Fan-Out Volume Production

Nepes has successfully produced the world's first 600mm x 600mm large panel level packaging (PLP) using Deca's M-Series fan-out technologies.

2021-12-29 - Industrial Technology Research Institute

Heterogeneous Integration Chiplet System Package Alliance Established

The Hi-CHIP alliance will help create a complete ecosystem covering package design, testing and verification, and pilot production.

2021-12-29 - Stefani Munoz

Applied Materials, IME Extend Hybrid Bonding Research

Applied Materials and Singapore's IME will extend research via a combined $210 investment aimed at advancing hybrid bonding technology.

2021-11-23 - Samsung Electronics Co. Ltd

Samsung Electronics Expands Portfolio of ‘Green’ Chips

Five memory products achieved carbon reduction certification, while automotive LED packages received carbon footprint verification.

2021-11-09 - Amkor Technology Inc.

Amkor Plans New Vietnam Factory to Expand Advanced Packaging Technology Capacity

Amkor plans to build a state-of-the-art smart factory in Bac Ninh, Vietnam to expand its advanced packaging technology capacity.

2021-10-14 - Xperi Holding Corp.

YMTC Licenses Xperi’s Hybrid Bonding Technology

Xperi has licensed its Direct Bond Interconnect (DBI) hybrid bonding portfolio to YMTC for its 3D NAND memory products.

2021-06-02 - Don Scansen

What to Expect at the VLSI Technology Symposium

The papers from the upcoming VLSI Technology Symposium suggest there's some agreement on general direction, but little agreement on terminology.