2022-03-08 - ATP Electronics

New Die Package Extends ATP’s 3D TLC e.MMC Endurance to MLC/SLC Levels

ATP Electronics has introduced its latest line of e.MMC devices built on 3D triple level cell (TLC) NAND.

2021-08-31 - Gary Hilson

Emerging Memories Look to Displace NOR, SRAM

Emerging memories are projected to be a $44 billion market by 2031, likely displacing NOR flash, SRAM, and DRAM.

2021-07-22 - Winbond Electronics Corp.

Winbond and Synopsys Deliver Complete High-Density NAND Flash Memory Solution

The successful interoperability of Synopsys' DesignWare IP and Winbond's OctalNAND Flash Memory has delivered a complete high-density NAND flash memory…

2021-07-15 - TrendForce

TrendForce: NAND Flash Contract Prices to Increase 5-10% QoQ in Q3

TrendForce forecasts that contract prices of NAND Flash products will rise marginally for 3Q21, with QoQ increases in the range…

2021-06-17 - IC Insights

IC Insights Raises Its 2021 Global IC Market Forecast

IC Insights raised its 2021 IC market growth forecast from 19% to 24% amid continued strength in the memory segment…