TrendForce has lowered the YoY growth rate of their total server procurement quantity for this year from the original projection…
Nokia, Microsoft, and Qualcomm executives presented at the Brooklyn 6G Summit.
Industry leaders have formed a consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.
As part of its "Bersama Malaysia" (Together with Malaysia) initiative, Microsoft will establish its first datacenter region in the country…
STMicroelectronics' new extreme power-saving MCUs meet the most demanding power/performance requirements for smart applications.