Will Emerging Memories Ever See the Light of Day?
Healthy markets are possible for emerging memories without trying to supplant DRAM or NAND flash...
Apacer’s Cloud-edge Integration Online Exhibition Reveals Diversified Solutions
Apacer has launched its Cloud-edge Integration online expo. With its strong R&D momentum, Apacer's Cloud-edge Integration Online Exhibition reveals diversified…
Hard Disk Drives in the Circular Economy
Disk drives are smaller and use less material, but we're making more than ever. What are we to do with…
SiOx ReRAMs Promise to Accelerate AI Self-Learning
Researchers at Politecnico Milan used Weebit ReRAM provide inference hardware with brain-like plasticity...
DRAM Module Revenue Decreases by 3% YoY in 2019
DRAM module revenue decreases by 3% YoY in 2019, with varying performances by top 10 module makers, says TrendForce
Teardown: A Look at IBM Power9’s Micro-Architecture
A teardown of IBM's Power9 14HP DTC SOI FinFET eDRAM shows several significant technological changes from the company's preceding Power8.
JEDEC-Compliant Precision Temperature Sensor for DDR5 Memory Modules
New IC joins a complete family of DDR5 DIMM solutions that include the registered clock driver, power management IC and…
Supercharged Innodisk DDR4-3200 DRAM
Innodisk’s DDR4-3200 DRAM module lineup provides technology leaders with the performance and features necessary to capitalize on the future of…
Thermal stress and signal compliance
Embedded edge server designs with high-speed interfaces
Samsung Announces First 512GB Embedded UFS
Samsung Electronics said it has begun mass production of the first 512GB embedded Universal Flash Storage (eUFS) device.