Teardown: A Look at IBM Power9’s Micro-Architecture
A teardown of IBM's Power9 14HP DTC SOI FinFET eDRAM shows several significant technological changes from the company's preceding Power8.
JEDEC-Compliant Precision Temperature Sensor for DDR5 Memory Modules
New IC joins a complete family of DDR5 DIMM solutions that include the registered clock driver, power management IC and…
Supercharged Innodisk DDR4-3200 DRAM
Innodisk’s DDR4-3200 DRAM module lineup provides technology leaders with the performance and features necessary to capitalize on the future of…
Thermal stress and signal compliance
Embedded edge server designs with high-speed interfaces
Samsung Announces First 512GB Embedded UFS
Samsung Electronics said it has begun mass production of the first 512GB embedded Universal Flash Storage (eUFS) device.
Transitioning to Next-Gen DDR5 DIMM Buffer Chipsets
There are a number of key changes to DDR that introduce new design challenges. However, savvy designers will use the…
Server DRAM Contract Prices to Drop in 2019
Server DRAM contract prices to fall by over 20% QoQ in 1Q19, due to difficulties in reducing inventory, says TrendForce.
DRAM Market to See Lower CapEx in 2019
DRAM Market to See Lower Capital Expenditure and Moderated Bit Output in 2019 Due to Weak Demand, Says TrendForce...
Taiwan’s Adata joins top memory card vendors
Adata Technology's product portfolio includes USB drives, dynamic RAM modules and memory cards. It also caters to express cards, solid-state…
NVMe SSD read transfer speed reaches 5.5GB/s
The Micron 9200 is one of the first NVMe SSDs on the market with a capacity exceeding 10TB.