US DoD Expands Trusted Chip Deal with GlobalFoundries
Another step toward rebuilding the U.S. semiconductor supply chain...
Advanced Dielectric Gapfill Technology to Enable Next-Gen Memory
Lam Research’s recently announced Striker FE enhanced atomic layer deposition (ALD) platform addresses semiconductor manufacturing challenges for 3D NAND as…
Debt-Ridden China HSMC Faces Restructuring
HSMC became a casualty during the technology war between China and the US, but the company had been debt-ridden and…
Getting Started with Silicone Conformal Coatings
Solventless conformal coatings that are made of silicone support sustainability initiatives and can improve production efficiency...
Is ‘All Made in China’ the Right Strategy?
“Is ‘all made in China’ the right strategy?” questioned Prof. Wei Shaojun in his keynote speech at Aspencore’s 2020 Global…
Why is Apple M1 Processor Passing on the Chiplets?
In light of Apple’s M1 processor announcement recent;y, let me ponder why Apple passed on the chiplets, and where I…
Advanced Packaging: Interview with Intel’s Ramune Nagisetty
The IC industry is renewing its focus on advanced packaging. Chiplets may be the least mature option, but it is…
What’s Ahead for the Semiconductor Manufacturing?
Consolidation and speed-to-market success in foundries have enabled leading semiconductor companies to compete successfully without their own manufacturing fabs...
GlobalFoundries Details Ambitious Technology Roadmap
GlobalFoundries discussed its technology roadmap; its plan to invest $1.4B in 2021; its expectation it will achieve profitability; and its…
UMC to Focus More on Foundry Business in the Future
While close to settling legal case with U.S., UMC will be focusing more on its foundry business in the future,…