2022-11-18 - Cadence Design Systems Inc.

Cadence Launches 22Gbps GDDR6 IP at TSMC N5

The Cadence IP for GDDR6 is silicon proven on TSMC’s N5 process technology, exceeding Cadence's previous 16Gbps designs.

2022-10-19 - NeoLogic

NeoLogic Takes Processors Beyond Moore’s Law

NeoLogic's chip design technology is fully compatible with the existing manufacturing as well as EDA tools so it can seamlessly…

2022-09-05 - Sally Ward-Foxton

Arm Sues Qualcomm Over Nuvia Licenses

Does Qualcomm's existing architecture license cover cores previously developed at Nuvia?

2022-07-15 - ESD Alliance

Electronic System Design Industry Up 12% YoY in Q1

The electronic system design (ESD) industry revenue increased by 12.1% YoY to $3.54 billion in Q1 2022, according to the ESD Alliance.

2022-07-14 - Cadence Design Systems Inc.

Cadence Advances Comms Processing for Automotive, Consumer, and Industrial Markets

Cadence has expanded its Tensilica ConnX family with the debut of two new DSP IP cores for embedded processing in…

2022-07-04 - Cadence Design Systems Inc.

Cadence Expands Collaboration with Arm to Accelerate Mobile Device Silicon Success

Cadence has extended its collaboration with Arm to accelerate mobile device silicon success using its digital and verification tools and…

2022-06-30 - Cadence Design Systems Inc.

Cadence PHY and Controller IP in TSMC N7, N6 and N5 Process Nodes Achieves PCIe 5.0 Compliance

Cadence's PHY and Controller IP for PCIe 5.0 specification in the TSMC N7, N6 and N5 process technologies have passed…

2022-06-14 - Alphawave IP

Alphawave Launches Two Interconnect IPs in TSMC Advanced Processes

The two new IPs expand and extend Alphawave's technology leadership in chiplets and optical solutions.

2022-06-02 - Cadence Design Systems Inc.

Cadence Expands VIP Portfolio

Cadence's latest VIP offerings empower customers to confidently develop their next-gen industrial, automotive, hyperscale data center, and mobile SoCs.

2022-06-01 - Nitin Dahad

Imagination Open Access Lowers Barrier to SoC Design

New Open Access program lowers barrier to SoC design, providing access to a range of Imagination IP, software, and tools…

2022-05-05 - Xperi Holding Corp.

Xperi and LAPIS Enter into Hybrid Bonding License Agreement

Adeia and LAPIS have signed a technology transfer agreement, which includes the DBI Ultra die-to-wafer hybrid bonding know-how.

2022-04-29 - Arm

Arm Expands IoT Solutions Portfolio

Arm has launched Cortex-M85 processor and is expanding the Arm Virtual Hardware to more platforms.