2017-02-02 - R. Colin Johnson

Carbonics shows stripes with Zebra carbon wafer

Carbonics has created carbon-on-silicon wafers that allow aligned nanotubes to serve as fast channels for transistors, ideal for the transition…

2017-02-01 - Jett McCandless

Third-party APIs improve supply chain execution

Third-party API networks deliver unprecedented speed and scalability by advancing how connectivity solutions are developed and brought to market.

2017-01-30 - Marco Cassis

Cassis calculates: 4 key trends for 2017

STMicroelectronics' Asia-Pac EVP Marco Cassis sees growth in the electronics industry driven by an increasing pervasion of intelligence and connectivity.

2017-01-30 - Marco Cassis

Cassis calculates: Smart homes, smarter cities

STMicroelectronics' Asia-Pac EVP Marco Cassis believes intelligence will finally penetrate homes, roads and the floors of factories this year.

2017-01-27 - Silicon Labs

Silicon Labs extends IoT portfolio with Zentri buy

With the acquisition, Silicon Labs aims to deliver comprehensive, multiprotocol silicon and software to securely connect IoT products to the…

2017-01-24 - IC Insights

What fuelled 2016 semicon M&As?

The deals’ dollar values in 2015 and 2016 are 8 times greater than the $12.6 billion annual M&A average in…

2017-01-19 - ETSI

CIM group promotes smart cities interoperability

The ISG CIM will specify protocols that run “on top” of IoT platforms and allow exchange of data together with…

2017-01-13 - Maximilian Teodorescu

Qualcomm heralds 5G as messiah of mobile connectivity

5G goes well beyond the ability to wirelessly download full-length 4K films in 20 seconds or less, affecting entire industries,…

2017-01-12 - Brian Dipert

What’s inside the video streaming CX-10W drone?

Cheerson’s CX-10W simultaneously supports 2 different 2.4GHz protocols--IEEE 802.11 and Panchip Microelectronics' proprietary scheme.

2017-01-12 - Technavio

IoT penetration to boost LPWAN revenue

The increased adoption of LPWAN in various industries is likely to improve the overall market revenue in the next few…

2017-01-12 - Sequans Communications

Sequans builds LTE-M chip for IoT on TSMC’s ULP

Monarch complies with the ultra-low-power and reduced complexity requirements of the 3GPP release 13 LTE Advanced Pro standard, according to…

2017-01-11 - MIPI Alliance

MIPI I3C spec streamlines sensor integration

MIPI I3C specifies a chip-to-chip interface that can connect all sensors in a device to the application processor.