The low temperature hybrid wafer bonding allows wafers to be bonded with fine pitch 3D electrical interconnect without requiring bond…
The expectation is that China’s internet services and industrial applications will grow hand in hand to create diversified applications.
Efforts to lay out China's IIoT are still embryonicm but thanks to the IIoT application environment, the sector is growing…
The GaNonCMOS project aims to develop reliable GaN processes, while the Panel-Level Packaging Consortium plans to implement PCB panel-level packaging.
DCT’s SoC has been tapped by European THINGS2DO project to help create a camera-based ADAS reference platform using its data…
FDK and Fujitsu have developed a lithium cobalt pyrophosphate cathode, paving the way for all-solid-state batteries with higher voltage and…
Intel accounts for about 23% of the $56.5 billion total worldwide semiconductor R&D expenditures in 2016, according to IC Insights.
The three-year training in Japan encompasses practical cyber-attack defence drills to render necessary drills, products and services to help in…
IBM, Indiegogo and Arrow Electronics have teamed up to give entrepreneurs free access to IBM's Watson IoT platform and discounts…
The FLINGO project focuses on the functional layers and processes to develop LEDs for lifetime electrical resistance and improved light…
The OpenFog Consortium has discussed security, interoperable services and common crypto mechanisms to push market acceptance of IoT services.
Alliances have started consolidating in 2016, although we cannot expect the high-level mergers of groups to align leading wireless protocols.