SMIC taps bonding tech for image sensor manufacturing
The low temperature hybrid wafer bonding allows wafers to be bonded with fine pitch 3D electrical interconnect without requiring bond…
IIoT growing faster than consumer IoT in China
The expectation is that China’s internet services and industrial applications will grow hand in hand to create diversified applications.
China bets big on Industrial IoT
Efforts to lay out China's IIoT are still embryonicm but thanks to the IIoT application environment, the sector is growing…
Projects target GaN processes, panel-level packaging
The GaNonCMOS project aims to develop reliable GaN processes, while the Panel-Level Packaging Consortium plans to implement PCB panel-level packaging.
Auto SoC reference platform accelerates design time
DCT’s SoC has been tapped by European THINGS2DO project to help create a camera-based ADAS reference platform using its data…
Cathode material boosts all-solid-state battery dev’t
FDK and Fujitsu have developed a lithium cobalt pyrophosphate cathode, paving the way for all-solid-state batteries with higher voltage and…
Intel tops semicon R&D spending
Intel accounts for about 23% of the $56.5 billion total worldwide semiconductor R&D expenditures in 2016, according to IC Insights.
NEC spearheads ASEAN cyber security training
The three-year training in Japan encompasses practical cyber-attack defence drills to render necessary drills, products and services to help in…
Collaboration fuels future IoT start-ups
IBM, Indiegogo and Arrow Electronics have teamed up to give entrepreneurs free access to IBM's Watson IoT platform and discounts…
R&D project targets LED design enhancement
The FLINGO project focuses on the functional layers and processes to develop LEDs for lifetime electrical resistance and improved light…
Consortium sets rules for IoT security
The OpenFog Consortium has discussed security, interoperable services and common crypto mechanisms to push market acceptance of IoT services.
Is IoT finally converging?
Alliances have started consolidating in 2016, although we cannot expect the high-level mergers of groups to align leading wireless protocols.
