2017-07-17 - Synopsys

SIP adds coverage for new programming languages

The new updates to Synopsys' Software Integrity Platform introduce Coverity Static Analysis support for the Swift programming language and improved…

2017-07-13 - Michael Allen

How ancillary services benefit PCB assembly

Besides PCB assembly, contract manufacturers offer other services that can help reduce a project's cost and lead time.

2017-07-11 - EE Times Asia

Synapse expands Asia footprint with Vietnam centre

Silicon Valley-based Synapse Design is looking for 100 highly-experienced engineers as it expands its operations in Vietnam.

2017-06-30 - Adrien Sandrini

Blockchain removes semicon counterfeiting risks

The technology underpinning bitcoin has been specifically designed to answer the double spend issue, like counterfeiting in the semiconductor industry.

2017-06-01 - R. Colin Johnson

SaaS finds new meaning in the cloud

Starting with the Urika-GX model, the Markley Group plans to offer the whole Cray supercomputer line on a cloud rental…

2017-05-31 - Alan Patterson

Samsung splits foundry ops from system LSI

Separating Samsung’s contract chipmaking from its branded semiconductor business will remove a conflict of interest with potential customers and create…

2017-05-10 - Junko Yoshida

Can Foxconn lead Taiwan’s auto market bid?

Known for building Apple's iPhones and iPads, Foxconn may hold the key to Taiwan's success in the auto market.

2017-05-08 - Joanne Moretti

Augmented reality holds key to OEM innovation success

The fifth age is upon us, the augmented age, the age of artificial intelligence where we work with our tools,…

2017-05-05 - Gary Hilson

Take your facility into Industry 4.0 in 7 steps

DocLogix, like SharePoint, is a customisable platform focused on document and process management technology.

2017-04-06 - EE Times Asia

Digitalisation to push security-related spending

Global spending on security solutions will achieve an 8.7% CAGR through 2020, when revenues will be nearly $105 billion, according…

2017-03-28 - EE Times Asia

Transition to substrates for ICs below 10µm begins

Future higher-end products will require package substrates with L/S

2017-03-22 - Paula Doe

IIoT standard seeks to link wafer fabs with EMS

Some vendors are calling for the Electronics Manufacturing Service sector to adopt some version of automation standards already in use…