2016-10-07 - MagnaChip Semiconductor

Slim Flash process cuts down embedded layers by 20%

MagnaChip plans to merge Slim Flash into various technologies, including BCD and high voltage.

2016-10-06 - Stephan Ohr

Universal stylus standard gains traction

Developers believe the use of USI standard (1.0) will dramatically expand to use of stylus-dependent applications.

2016-09-30 - Vivek Nanda

ST extends STM32F4 series, adds 125°C devices

STMicroelectronics has extended its STM32F4 MCU series with devices that offer more memory, extra features and temperature qualification to 125°C.

2016-09-26 - Nordson March

Confinement ring isolates plasma on wafer

The ring focuses the plasma directly over the wafer to speed up the etching process and provide uniform plasma coverage.

2016-09-13 - KnowMade

Microbattery players corner key IP

Top patent holders could potentially block IP development for the booming microbattery market.

2016-09-11 - Peter Clarke

Globalfoundries rolls out 12nm FDSOI process

The company has announced a next-generation FDSOI process to follow on from the 22FDX process that is nearing production.

2016-09-04 - Linear Technology

18V prioritiser reduces operating current to 3.6µA

With up to 18V operating capability, the LTC4420 accommodates a wide range of power sources.

2016-08-29 - Peter Clarke

AMD breaks into top 20 chip vendor ranking

The top-20 ranking of semiconductor companies by sales in 1H16 shows that MediaTek and AMD both had good second quarters…

2016-08-29 - Littelfuse

On Semi sells automotive products unit to Littelfuse

Littelfuse also plans to invest approximately $30 million in its semiconductor fabrication locations to enhance its production capabilities.

2016-08-26 - Mellanox

Mellanox opens new Singapore headquarters

A first of its kind in the region for Mellanox, the joint office and hi-tech solutions centre is expected to…