2022-05-05 - Majeed Ahmad

Apple Lawsuit Puts Spotlight on SoC Design Engineering

Apple's lawsuit claims that Rivos has committed trade secret theft of its homegrown chip designs.

2022-04-29 - Applied Materials Inc.

Applied Materials Enables 2D Logic Scaling with EUV and 3D GAA

Applied Materials has launched innovations that help customers continue 2D scaling with EUV and next-generation 3D GAA transistors.

2022-04-28 - Gary Hilson

Etch Tools Continue 3D Evolution to Keep Pace with Moore’s Law

Lam Research's selective etch tools aim to help chipmakers leap from planar to 3D structures.

2022-04-22 - Majeed Ahmad

Disrupt or Be Disrupted: Intel and the Great Semiconductor Fab Game

Find out where Intel stands in its bid to compete with fab business behemoths TSMC and Samsung.

2022-04-21 - Ed Seng

A Post-Moore’s Law World

In a post-Moore's Law world, there will be lots of unknowns. Will the benefits of chiplets be realized? How will…

2022-04-11 - Gary Hilson

Chiplets Get a Formal Standard with UCIe 1.0

The recently announced UCIe 1.0 specification provides a complete standardized die–to–die interconnect with physical layer, protocol stack, software model, and…

2022-04-06 - ESD Alliance

Electronic System Design Industry Up 14.4% YoY in Q4 2021

ESD industry revenue increased by 14.4% year-on-year to $3.468 billion in Q4 2021, according to the ESD Alliance.

2022-03-25 - TrendForce

Top 10 IC Design Companies Post 2021 Revenue Topping $100B

Revenue of the global top 10 IC design companies reached $127.4 billion in 2021, up by 48% YoY, according to…

2022-02-18 - Siemens Digital Industries Software

Siemens Joins Intel Foundry Services’ EDA Alliance Program

As part of the alliance, Siemens plans to collaborate closely with IFS to optimize best-in-class IC design tools, flows and…

2022-02-07 - Alan Patterson

Samsung Readies Gate-All-Around Ramp

The new process technology that provides greater transistor density is likely to be ready during the first half of 2022.

2021-12-27 - Industrial Technology Research Institute

ITRI VLSI-TSA and VLSI-DAT Symposia Kicks Off in April 2022

ITRI will host the 2022 VLSI-TSA and VLSI-DAT on April 18–21, 2022 at the Ambassador Hotel Hsinchu, Taiwan.

2021-12-15 - Stefani Munoz

IBM, Samsung Breakthrough Extends Moore’s Law

Vertical transfer FETs are situated perpendicular to a chip substrate, allowing electric currents to flow vertically.