2022-03-15 - Global Unichip Corp.

GUC Announces 2.5D and 3D Multi-Die APT Platform for AI, HPC, Networking ASICs

GUC has announced a platform to shorten design cycles and for low risk, high yield production of ASICs adopting TSMC…

2021-12-10 - Cadence Design Systems Inc.

Cadence Digital Full Flow Accelerates GUC’s Time to Tapeout

GUC was able to accelerate the time to tapeout of its ASIC designs by leveraging the Cadence Innovus Implementation System.