Mobile Demand Fuels DRAM Revenue Growth to $19B in Q1 2021
Global DRAM revenues rose to $19 billion in the first quarter of 2021, increasing by a solid 30% YoY and…
IC Insights Raises Its 2021 Global IC Market Forecast
IC Insights raised its 2021 IC market growth forecast from 19% to 24% amid continued strength in the memory segment…
Automotive DRAM Demand Projected to Surpass 30% CAGR in Next 3 Years
Driven by such factors as the continued development of autonomous driving technologies and the build-out of 5G infrastructure, the demand…
Inside Samsung’s D1z LPDDR5 DRAM with EUVL
We have finally found new and advanced Samsung D1z DRAM devices and confirmed details of this technology...
SK Hynix Completes M16 DRAM Fab
SK Hynix dedicated its new M16 fab in South Korea. It should start cranking out 1anm DRAM later this year...
Top 10 IC Growth Categories Target Emerging Applications in 2021
Memory, auto-specific, and embedded MPUs expected to outpace total IC market growth this year.
Micron Jumps Ahead with 1α Node DRAM
Micron's 1-alpha node DRAM is already in volume production of DDR4 with LPDDR4 in sampling...
DRAM Leads in Revenue, NAND with Top Percentage Growth in 2020
21 of 33 IC product categories to see positive growth in 2020 demonstrating remarkable resilience of IC market during pandemic-induced…
Local Foundry and DRAM Manufacturing Remain Unaffected Following December 10 Earthquake in Taiwan
An earthquake that was 6.7 in magnitude occurred off the eastern coast of Taiwan at 9:19 p.m. on December 10.…
The DDR5 Revolution: Promise & Challenges Ahead
DRAM creates new possibilities for designers, with DDR5 featuring bandwidth and efficiency improvements to enable AI, high performance computing, niche…
DRAM ASP to Recover from Decline in 1Q21
The overall ASP of DRAM products is now forecasted to stay generally flat or slightly up for 1Q21, with potential…
Advanced Dielectric Gapfill Technology to Enable Next-Gen Memory
Lam Research’s recently announced Striker FE enhanced atomic layer deposition (ALD) platform addresses semiconductor manufacturing challenges for 3D NAND as…
