Cadence and GlobalFoundries Collaborate to Advance Silicon Photonics IC Design
Cadence is collaborating with GlobalFoundries to accelerate silicon photonics IC development for 5G communications, hyperscale computing, IoT, and aerospace systems.
Cadence Receives TSMC OIP Award for 3D-IC Design
Cadence has received a TSMC OIP Ecosystem Forum Customers’ Choice award for a paper titled, "Integrated Platform for 3D-IC Design."
Cadence and Dassault Systèmes Collaborate to Transform Electronic Systems Development
Cadence and Dassault Systèmes are partnering to provide customers with integrated, next-generation solutions for the development of high performance electronic…
Cadence Joins Intel Foundry Services Ecosystem Alliance to Advance Chip Design Innovation
Cadence has joined the new IFS Ecosystem Alliance to support mutual customers with the development and delivery of innovative SoC…
Cadence Accelerates IP-to-SoC-level Verification for Complex Memory Controllers
The full DRAM verification solution enables customers to quickly and effectively perform IP-to-SoC-level verification of advanced designs with multiple DDR…
Cadence Platform Accelerates Microchip’s Data Center Solutions SoC Development
The Palladium Z2 provided Microchip with 2X better emulation capacity, enabling more simultaneous users and 1.5X greater performance gains.
Innatera Neuromorphic AI Chip Accelerates Spiking Networks
The startup receives first ultra-low power chips from fab, reveals architectural details, recruits Cadence and Synopsys co-founder as chairman.
Sequans Adopts Cadence RF Solution for Next-Gen 5G IoT Platform
Sequans has successfully adopted Cadence's RF solutions to develop its next-generation 5G IoT platform.
