Eliyan Corporation’s chiplet interconnect cost-effectively connects homogeneous and heterogenous architectures on standard organic substrate.
N4X is the first of TSMC’s HPC-focused technology offerings, representing ultimate performance and maximum clock frequencies in the 5-nanometer family.
Closer collaborations between package and system designers to optimize package system integration will help maximize system performance.
Next-generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall…
Moore's Law in process technology is on its last legs, so advanced packaging is taking up the baton.