VeriSilicon's chip design process has obtained ISO 26262 automotive functional safety management system certification.
Apple's lawsuit claims that Rivos has committed trade secret theft of its homegrown chip designs.
Applied Materials has launched innovations that help customers continue 2D scaling with EUV and next-generation 3D GAA transistors.
Lam Research's selective etch tools aim to help chipmakers leap from planar to 3D structures.
Find out where Intel stands in its bid to compete with fab business behemoths TSMC and Samsung.
In a post-Moore's Law world, there will be lots of unknowns. Will the benefits of chiplets be realized? How will…
The recently announced UCIe 1.0 specification provides a complete standardized die–to–die interconnect with physical layer, protocol stack, software model, and…
ESD industry revenue increased by 14.4% year-on-year to $3.468 billion in Q4 2021, according to the ESD Alliance.
Revenue of the global top 10 IC design companies reached $127.4 billion in 2021, up by 48% YoY, according to…
As part of the alliance, Siemens plans to collaborate closely with IFS to optimize best-in-class IC design tools, flows and…
The new process technology that provides greater transistor density is likely to be ready during the first half of 2022.
ITRI will host the 2022 VLSI-TSA and VLSI-DAT on April 18–21, 2022 at the Ambassador Hotel Hsinchu, Taiwan.