2021-04-01 - Ravi Mahajan

Optimizing Package System Integration Maximizes System Performance

Closer collaborations between package and system designers to optimize package system integration will help maximize system performance.

2021-03-02 - Don Scansen

ISSCC: Roadmap on 3D Interconnect Density

The common theme coming out of the chiplet forum at ISSCC was the need for a 3D interconnect density roadmap.

2020-12-28 - Majeed Ahmad

Advanced Packaging For More-than-Moore Era

Chip scaling has reached the point of diminishing returns. The next phase of semiconductor innovation will focus on integrating a…

2020-11-12 - Nitin Dahad

CEA-Leti, Intel Expand Collaboration on 3D Packaging

3D packaging research will focus on assembly of smaller chiplets, optimizing interconnection technologies between the different elements of microprocessors, and…