Closer collaborations between package and system designers to optimize package system integration will help maximize system performance.
The common theme coming out of the chiplet forum at ISSCC was the need for a 3D interconnect density roadmap.
Chip scaling has reached the point of diminishing returns. The next phase of semiconductor innovation will focus on integrating a…
3D packaging research will focus on assembly of smaller chiplets, optimizing interconnection technologies between the different elements of microprocessors, and…