2020-11-24 - Gary Hilson

Advanced Dielectric Gapfill Technology to Enable Next-Gen Memory

Lam Research’s recently announced Striker FE enhanced atomic layer deposition (ALD) platform addresses semiconductor manufacturing challenges for 3D NAND as…

2020-11-16 - Gary Hilson

World’s First 176-Layer NAND Achieves Breakthrough Performance and Density

Micron delivers a breakthrough in flash memory performance and density...

2020-10-15 - Strategy Analytics

Samsung Widens its Lead in the Smartphone DRAM & NAND Market in 1H20

High-density chips drive market revenue...

2020-03-10 - Gary Hilson

Are There Better Ways to Stack DRAM?

With a new patent and technology license agreement, will Xperi's DBI stacking technology drive down costs for wider adoption?

2020-02-14 - George Leopold and Junko Yoshida

Wuhan: Manufacturing Hub & China’s Optics Valley

The beleaguered Chinese manufacturing hub faces a virus-borne existential crisis.

2020-02-06 - Gary Hilson

Minimal Transitions, Flat Pricing for Memory in 2020

The 2020 outlook for the memory market looks flat, with transitions doubtful and impact expected from Brexit, trade wars, and…

2019-06-28 - Dylan McGrath

Micron Resumes Some Shipments to Huawei

U.S. memory chip supplier Micron Technology said it would reduce its capital spending plans for fiscal 2019 and 2020 and…

2019-05-28 - Gary Hilson

Portable Flash Demand Powered By USB

USB storage shows no sign of disappearing and it's even finding new use cases

2019-03-05 - Gary Hilson

1 TB Memories to Boost Smartphones

Consumers looking to store more 4K videos of their cats are in luck. Samsung Electronics recently began mass-producing one terabyte…

2018-06-11 - Jeongdong Choe, Senior Technical Fellow, Techinsights

Deep Inside SK’s 72-Layer NAND

Senior TechInsights analyst picks apart SK Hynix's 72-layer 256Gb NAND

2017-10-11 - Sang-Yun Lee, CEO, BeSang Inc.

Limitations of 3D NAND Scaling

The life span of 3D NAND might be a lot shorter than most people think.