Smiths Interconnect's Galileo test socket is an innovative, low-profile test socket engineered to support today's high-performance digital and RF applications.
Smiths Interconnect has launched its new Galileo test socket, an innovative, low-profile test socket engineered to support today’s high performance digital and RF applications. Suitable for for area array and peripheral package test, Galileo leverages proven interposer elastomer technology and advanced 3D printing manufacturing to provide a high-performance solution for BGA, LGA, QFP, SOIC, or QFN packaged devices with extremely short lead times.
“A good portion of customers have products with critical time-to-market (TTM) goals. When speed is what they need, Galileo test socket provides an accurate, at-speed and cost-competitive test solution. Given the efficiency it provides, we have named the product after the Italian physicist and engineer, Galileo who made a significant contribution to speed and velocity studies,” said Bruce Valentine, Vice President and General Manager of the Semiconductor Test Business Unit at Smiths Interconnect.
Using a unique “universal” elastomer contact assembly, Galileo supports almost any standard package pinout, on any pitch (or multiple pitches) at >0.35mm, in any configuration, with no extra tooling charges. A single socket can be re-used across multiple pitches and pad/ball placement. In addition, no contact alignment or registration holes are required in the PCB, enabling quick and easy board integration.
Galileo elastomeric test socket offers the following features: