15dB gain block delivers 47dBm OIP3 linearity
The LTC6433-15 simplifies wideband design and allows easy cascading with minimal external components.
NI boasts low-latency software design in next-gen VST
The PXIe-5840 module is the first 1 GHz bandwidth VST, aiming to set a new standard for density, performance and…
Hitkit supports designs in analogue 180nm CMOS tech
The PDK provides a plug-and-play tool set with improved analogue features and device performance as well as highly accurate simulation…
SoftBank banks hard on hardware
SoftBank’s CEO stresses that ARM will become central to the company's core biz, and that hardware is key to platform…
Architecture for AI, security can leverage SoftBank: IHS
Son envisions ARM to define a platform for the future of secure IoT, connected cars and artificial intelligence.
IoT to propel sensors, peripherals growth by 24% by 2021
ABI Research reckons sensors and peripherals will be 65% of an installed base of 47 billion units by 2021, double…
Waveguide bends operate up to 90GHz across 12 bands
In waveguide systems that require a signal to turn or bend 90 degrees, precision waveguide bends are used as to…
BeSang slashes 3D NAND flash cost to $0.02/GB
Frustrated with Hynix's slow implementation of its monolithic 3D technology, BeSang is opening the door to partnerships with other memory…
Vietnam mobile phone, parts export up 16% in H1
Cell phones and their spare parts have become Vietnam’s top export items this year, with shipments exceeding US$21.5 billion.
TSMC punts on extreme ultraviolet at 5nm
The company has been using 7nm as a development vehicle for EUV, achieving what it called good integration of EUV…
SoftBank establishes firm foothold in ARM chip tech
Where should ARM place its next 1,500 engineers—and what could the merger mean for the semiconductor industry?
Mobile IC market to reach $94B in 2019
The cellphone IC market CAGR is forecast to exceed the total IC market by as much as three points during…
