2022-08-09 - InnovationLab

InnovationLab Demos Breakthrough AM-based PCB Production Method

InnovationLab's breakthrough in additive manufacturing of PCBs helps meet higher environmental standards for electronics production while also reducing costs.

2022-08-09 - GlobalFoundries

GlobalFoundries, Qualcomm Extend Semiconductor Manufacturing Agreement

GlobalFoundries and Qualcomm are more than doubling their existing strategic global long-term semiconductor manufacturing agreement previously entered into their respective…

2022-08-09 - STMicroelectronics

STMicroelectronics Launches Multi-zone ToF Sensor for User Presence Detection, Gesture Recognition

STMicroelectronics' latest FlightSense ToF multi-zone sensors can detect multiple targets in 64 zones within a wide 61-degree field of view.

2022-08-08 - Semiconductor Industry Association

Lip-Bu Tan to Receive Semiconductor Industry’s Highest Honor

Lip-Bu Tan has been named the 2022 recipient of the semiconductor industry's highest honor, the Robert N. Noyce Award.

2022-08-08 - ABI Research

Global Revenues for Intelligent Speed Assistance and Autonomous Vehicle Maps to Surpass $500M by 2027

Over 47 million vehicles in circulation by 2027 will rely on digital maps to underpin active safety or autonomous driving…

2022-08-08 - Microchip Technology Inc.

Microchip Expands Portfolio of MPU-based SOMs

Microchip's latest small-form-factor system-on-module eases design and manufacturing and speeds time to market.

2022-08-08 - Quanergy Systems Inc.

Quanergy Launches 2D 360° PoE LiDAR Sensor

Quanergy's M1 Edge PoE LiDAR sensor provides higher detection accuracy at a lower price than competing LiDAR solutions.

2022-08-08 - Cadence Design Systems Inc.

Cadence Verification IP and System VIP for CXL 3.0 Accelerate Hyperscale SoC Design

Integrated with the Cadence VIP for PCIe 6.0, the VIP for CXL 3.0 provides a complete solution from IP to…

2022-08-08 - Anne-Françoise Pelé

Scintil Photonics Speeds Up Communications in Data Centers

Silicon photonics integration enables cost-effective, low-power optical interconnects in HPC systems and data centers.

2022-08-05 - Cadence Design Systems Inc.

Cadence Accelerates Delivery, Enhances Quality of Arm Memory Products

With Cadence Liberate MX Trio, Arm achieved the accuracy and capacity required to address advanced-node memory characterization challenges.

2022-08-05 - TrendForce

Intel Orders Delayed, TSMC Slows 3nm Expansion

Intel's mass production of the tGPU chipset in Meteor Lake will be postponed to the first half of next year…

2022-08-05 - Martin Vallo and Eric Mounier

Global Insights into the Co-Packaged Optics Technology Platform

The value of optics and ASIC co-packaging for data centers could reach US$2B in 2032 if the technical challenges are…