UMC’s 14nm FinFET wafers feature 55% higher speed and twice the gate density over 28nm process technology.
United Microelectronics has started the production of its self-developed 14nm FinFET technology. The foundry is shipping 14nm wafers to customers and has achieved yields for the advanced process that is being utilised for consumer electronic applications.
UMC’s 14nm FinFET technology features 55% higher speed and twice the gate density over 28nm process technology. The 14nm process also consumes approximately 50% less power than 28nm.
UMC is producing the 14nm customer ICs at the company’s Fab 12A in Tainan, Taiwan.