CyberOptics airborne particle sensors, WaferSense and ReticleSense, can measure both large particles and small particles down to 0.14μm in bins of 0.1 and 0.5μm, improving equipment set-up and long-term yields in semiconductor fabs.

The sensors' new particle detecting and measurement functionality extends the range, reporting particles in 2, 5, 10 and 30μm bin sizes.

“Essentially, the latest enhancements to our proven family of wireless semiconductor measurement devices help our fab and OEM customers deliver on three compelling bottom lines–saving time, saving expense and improving yields," said Dr. Subodh Kulkarni, president and chief executive officer, CyberOptics.

The company also introduced its auto multi sensors (AMS) line, which measure levelling, vibration and relative humidity (RH) in an all-in-one wireless real-time device. The thin and light form factor enables the AMS to travel through virtually any tool. The AMS can capture multiple measurements in all locations of the reticle environment, increasing yield and reduce downtime in semiconductor environments.