Using its resin design technology, Panasonic has developed a bonding sheet that can be laminated at less than 200°C and stored at room temperature.
Panasonic has introduced its low transmission loss flexible multi-layer circuit board materials, which the company says will address the growing need for faster transmission of signals.
Using its resin design technology, Panasonic has developed a bonding sheet that can be laminated at less than 200°C and stored at room temperature. This eliminates the need for special facilities for high-temperature lamination and refrigerated storage for bonding sheets. The company has also achieved high adhesiveness of liquid-crystal polymer (LCP) and low profile copper foil for the LCP core material by using its laminating techniques. It supports standards including USB 3.1 Gen 2 (10Gbps) and will enable increased speed of large-volume data transmission in mobile devices.
Furthermore, a coaxial cable is capable of large-volume data transmission, but its downside is its thickness. A low transmission loss flexible multi-layer circuit board has several signal lines within it, so large-volume data transmission and a thinner design can be achieved simultaneously. Adopting this material allows flexible multi-layer circuit boards, in a 0.2mm-thick, 3-layer structure that can carry several signal lines, to replace coaxial cables.