Ethernet GigEpack features 48Gb Ethernet ICs, USB 3.1 Gen 1connector and is supported by a series of Microchip switches, PHYs and LANs.
Microchip Technology has launched a suite of products, known together as GigEpack, which aims to ease up deployment of high-speed networks, opening up new uses and applications. The GigEpack includes single-chip Gigabit Ethernet switches with integrated HSR/DLR redundancy that are vital in manufacturing applications. Also included is the USB 3.1 Gen 1 to Gigabit Ethernet bridge which supports Advanced Driver Assistance Systems (ADAS) and infotainment systems on a variety of physical network layers.
Developed for industrial, automotive and consumer applications, GigEpack includes three key elements for ease of use and fast time to market. First, the whole portfolio is UNH-IOL (University of New Hampshire InterOperability Laboratory) certified. Second, all products come with free software drivers that are certified or third-party approved, compatible with operating systems running on copy-ready evaluation boards. Finally, the GigEpack suite is backed by Microchip’s free LANCheck online design service.
Figure 1: The Microchip GigEpack offers a comprehensive platform of Gigabit Ethernet products for ease of design and availability. (Source: Microchip)
The GigEpack includes three product series: The KSZ9477/9567/9897 switches allow users to create networks with HSR/DLR redundancy and transport audio and video with Audio/Video Bridging (AVB). The KSZ9567 switch, for example, has seven ports, an SGMII interface and EtherSynch technology, providing support for real-time Ethernet, IEEE 1588 v2 precision time protocol (PTP), AVB, and Time Sensitive Networking (TSN).
Meanwhile, the LAN7800/LAN7850/LAN7801 bridge series enables customers to add Gigabit Ethernet to embedded processors via USB 3.1 Gen 1, USB 2.0 or High Speed Inter-Chip (HSIC) bridging physical layers such as 1000Base-T, or 100Base-T1 and HDBaseT via RGMII.
These products join Microchip’s KSZ9031 family of Gigabit PHYs for performance and power efficiency.