TSVs have become the preferred interconnect choice for high-end memory, and an enabling technology for heterogeneous integration of logic circuits.
3D through-silicon via (TSV) is a reality, and all market segments—whether high end or low end—are being targeted by TSV technologies providers, according to Yole Developpement. In fact, the market research firm announced that high volume production using 3D TSV has already started, especially in the memory industry.
Among a dynamic advanced packaging market showing overall advanced packaging revenue CAGR estimated at 8%, and rising to $30 billion in 2020, the development of TSV platforms is still pushed by the need to the increase of performance, functionalities and integration, according to Yole. In addition, form factor and cost reduction are also part of the playground.
Figure 1: Packaging revenue forecast (Source: Yole Developpement)
The higher end market segment is led by 3D stacked memories, 2.5D integration and emerging application such as photonics. From its side, the low end application includes CIS, MEMS devices and other sensors and new applications such as LEDs.
TSVs have now become the preferred interconnect choice for high-end memory, the firm stated. They are also an enabling technology for heterogeneous integration of logic circuits with CIS, MEMS, sensors and RF filters. In the near future, they will also enable photonics and LED function integration.
“The market for 3D TSV and 2.5D interconnect is expected to reach around 2.1 million wafers in 2021, expanding at an 18% CAGR," said Santosh Kumar, Senior Technology & Market Analyst at Yole. The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centres, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 80% share of TSV market wafer volume in 2015, although this will decrease to around 56% by 2021. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors. However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 38% of CIS production by 2021. The TSV markets for RF filters and fingerprint sensors are expected to reach around $2.6 billion and $0.7 billion by 2021, respectively.
Figure 2: Packaging area roadmap (Source: Yole)
According to Yole’s analysts, 3DIC & 2.5D TSV continue its attractive growth. Under a dynamic ecosystem, a lot of valuable companies are involved in this field and propose innovative solutions. Because of the increasing consumer market, as well as the need for higher performance products such as 4K gaming, networking, 2.5D/3D TSV packaging platform becomes a key solution platform.