September 6, 2018 – Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the DP83TC811S-Q1 transceiver from Texas Instruments (TI). The AEC-Q100 qualified DP83TC811S-Q1 is an automotive Ethernet physical layer (PHY) transceiver that allows designers to introduce increased intelligence to automotive applications through Ethernet connectivity. The first 100BASE-T1 device to support serial gigabit media independent interface (SGMII), the DP83TC811S-Q1 is suitable for use in automotive body electronics, infotainment and cluster, and advanced driver assistance systems (ADAS) applications.

The TI DP83TC811S-Q1, available from Mouser Electronics, is a 100-Mbps single-pair Ethernet PHY transceiver with SGMII, which improves design flexibility by enabling connections to multiple switches and interfaces. The transceiver features low power consumption, which reduces thermal dissipation, allowing less space required between components. The robust DP83TC811S-Q1 transceiver also includes a physical medium dependent (PMD) filter and termination, MII terminators and power-supply filtering components, reducing the need for external circuitry. Because of this high level of integration, developers gain more space to incorporate additional features, allowing for flexible design of high-performance automotive applications.

The TI DP83TC811S-Q1 automotive transceiver features an integrated diagnostic toolkit, incorporating test modes and debug tools through a number of real-time monitoring functions. The diagnostic toolkit includes cable diagnostics, temperature and voltage sensors, and an electrostatic discharge (ESD) monitor, facilitating designs that can withstand high-voltage faults and ESD events.

The DP83TC811S-Q1 transceiver is compliant with the IEEE 802.3bw standard and OPEN Alliance qualification, enabling the use of unshielded single twisted-pair copper cable, which reduces overall cable weight and cost. The device’s small 6mm × 6mm wettable flank package enables a 50-percent smaller solution size while also allowing a visual indicator of solderability to lower inspection time.