Extreme ultraviolet lithography still faces reliability issues, but it's ready for volume use, Intel's EUV chief said
Headstart over TSMC could give Samsung a leg-up in the post-FinFET era
With yield woes contained, executives say the company will meet its holiday season target.
The Taiwan foundry sketched out a laundry list of processes and packaging options including a new N5P node at an annual event.
Samsung is starting to make chips in a 5nm EUV process, but gains are less impressive than past foundry nodes
The semiconductor roadmap could extend a decade to a 1-nm node or it could falter before the 3-nm node for lack of new resist chemistries
50% lower power consumption than on 10nm, may beat TSMC to market
3D stacking, AI and EUV should all help push transistors toward 3 and 2nm nodes, say TSMC
TSMC and Samsung ahead of Intel in the EUV race
On track to ship 20 EUV systems in 2018, as well as at least 30 more in 2019