Linear packages power module to share heat sink with processor

Article By : Vivek Nanda

Linear Technology has packaged its µModule regulator such that you can place it so close to FPGAs, GPUs or other processors that it can share the heat sink.

Linear Technology Corp. has introduced the LTM4631, a dual 10A or single 20A µModule (power module) step-down regulator in an LGA package with a 16mm x 16mm footprint.

The ultrathin 1.91mm LTM4631 can be placed on a PC board close enough to its load, such as an FPGA, while sharing one heat sink covering both of their low-profile packages.

[LTM4631 Fits On PCB Backside]
*__Figure 1:__ The LTM4631 can be mounted on the backside of circuit boards to free up space on the topside for other components. Source: Linear Technology.*

The small, thin package permits the LTM4631 to be mounted on the backside of circuit boards, freeing space on the topside for components, such as DDR-QDR memory and transceiver ICs. This is particularly useful for space constrained applications, including plug-in and mezzanine cards in embedded systems, data storage systems, gateway controllers and 40Gbps to 100Gbps networks.

The LTM4631 operates from 4.5V to 15V input supplies and regulates an output voltage from 0.6V to 1.8V with ±1.5% maximum total DC output voltage error from –40°C to 125°C. Its two outputs operate 180° out-of-phase, each capable of delivering 10A or 20A when the outputs current share as below.

*__Figure 2:__ You can hook up two LTM4631’s in parallel to increase output current and decrease ripple. Source: Linear Technology.*

Two devices can current share, delivering up to 40A while minimizing input and output ripple current. The device features output overcurrent foldback and overvoltage protection. The LTM4631 is rated for operation from –40°C to 125°C.

Linear has announced that the 1,000-piece pricing starts at $24.88 each.

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