The global semiconductor packaging materials market will track chip industry growth to expand from $17.6 billion in revenue logged in 2019 to $20.8 billion in 2024...
The global semiconductor packaging materials market will track chip industry growth to expand from $17.6 billion in revenue logged in 2019 to $20.8 billion in 2024, a 3.4 percent Compound Annual Growth Rate (CAGR), SEMI and TechSearch International forecast in the Global Semiconductor Packaging Materials Outlook released today.
A number of semiconductor industry growth drivers will power the surge including big data, high-performance computing (HPC), artificial intelligence (AI), edge computing, advanced memory, the 5G infrastructure build-out, 5G smartphone adoption, growth of electric vehicle adoption and enhanced safety features for automobiles.
Packaging materials are key to the growth of these applications, enabling advanced packaging technologies that undergird the higher performance, reliability and integration of next-generation chips.
Laminate substrates, the largest materials segment, will see a CAGR of over 5 percent, driven by demand for system-in-package (SIP) and high-performance devices. Wafer-level packaging (WLP) dielectric will register the highest growth with a 9 percent CAGR over the forecast period. The trend towards smaller, thinner packaging will dampen growth of leadframes, die attach, and encapsulant materials, though new technologies are being developed to enhance performance.
With the steady advance of semiconductor packaging technology innovation, the next several years are expected to present several areas of opportunity in the materials market including:
Other growth areas highlighted in the report’s forecast period from 2019 to 2024 include: