Flexible hybrid electronics showed progress on its journey from the lab to the market at an open house for NextFlex in San Jose, California. The U.S. research center was formed in late 2015 with about $165 million in private and public backing to drive the technology that marries on flexible substrates printed circuits and thinned silicon die. For instance, Jabil showed a handful of boards like the one pictured using traces and circuits printed on flexible substrates as well as thinned die mounted on them. (Rick Merritt, EE Times US)

Jabil's printed 1.5V battery used in a cosmetics application.

GE showed two generations of prototype ECG sensors. The latest (top) carves resistors into the plastic substrate. The company hopes to produce a commercial, reusable patch within a couple years and one cheap enough to be disposable within five years.

Boeing showed several types of printed antennas for aircraft including the 10 GHz ones above. Both it and the Air Force are already experimenting with conformal antennas that fit into aircraft wings.

Contract manufacturer Flex showed a work out shirt with ECG sensors, flexible lights and heating elements woven into it. The flexible heating elements are already in use in car mirrors and ski goggles.

Stanford students demonstrated a robotic arm wrapped in an array of sensors so it could detect and avoid objects as it moves. More at EE Times US (http://www.eetimes.com/document.asp?doc_id=1332343&page_number=1)