Foxconn has officially entered the manufacture and development of wide band gap semiconductors with the acquisition of Macronix's 6-inch wafer fab.
Non-volatile memory (NVM) designer and manufacturer Macronix International Co. Ltd and Hon Hai Technology Group (Foxconn) have signed an Asset Transaction Agreement for the sales of Macronix’s 6-inch wafer fab and equipment in Hsinchu Science Park to Foxconn for NT$2.52 billion. The transaction is expected to be closed by the end of 2021.
The agreement was signed by Dr. Chih-Yuan Lu, President of Macronix, and Dr. Bob Wei-Ming Chen, President of Foxconn Semiconductor Business Group (S Business Group). The event was also witnessed by Miin Wu, Chairman and CEO of Macronix, and Young Liu, Chairman and CEO of Foxconn. Not only does the transaction reflect Foxconn’s commitment to the long-term “3+3” (industry and technology) company vision but it also signifies a deeper commercial collaboration between Macronix and Foxconn.
“The acquisition of the 6-inch wafer fab in Hsinchu Science Park officially signals Foxconn’s entry into the manufacture and development of wide band gap semiconductors, especially SiC, paving the way for a long-term commitment to semiconductor development. The manufacturing of SiC is in line with Foxconn’s 3+3 strategy (EV, digital health, Robotics + AI, semiconductor, advanced communication). SiC MOSFET is an important device for EV, while EV occupies the No.1 position in Foxconn’s 3+3 strategy. The 6-inch wafer fab will function as S Business Group’s headquarters in Hsinchu, the world famous semiconductor cluster, enabling closer partnership with the semiconductor companies based in the Hsinchu Science Park,” said Liu.
“To enhance advanced technology and global competitiveness, Macronix will focus on 12-inch wafer business, especially R&D and manufacturing of the advanced 3D NAND Flash and NOR Flash products after capacity expansion. Macronix is pleased to see the subject 6-inch wafer fab continue to make its contribution to Taiwan as Foxconn commits to have the fab be used as an important base for Foxconn to reinforce its semiconductor development plan and to meet the demand of electric vehicles. Considering that Macronix is advancing to take the lead in the global automotive electronics market, a closer collaboration between Macronix and Foxconn in the near future may be anticipated,” said Wu.
The 6-inch wafer fab is located in Hsinchu Science Park with completed industrial supply chain. In addition to manufacturing SiC Power MOSFET, Foxconn confirmed that it will also manufacture silicon wafer products, such as MEMS, in order to achieve Foxconn’s strategic goals on development of semiconductors industry, EV, and digital health.