FIH Mobile, Stellantis Set Up JV on Smart Cockpit Solutions for Automotive Industry

Article By : Hon Hai Precision Industry Co. Ltd

FIH Mobile and Stellantis have set up a joint venture, Mobile Drive, that will focus on delivering smart cockpit solutions for vehicles.

Hon Hai Precision Industry Co. Ltd (Foxconn) together with its subsidiary FIH Mobile Ltd, and Stellantis N.V. have set up a joint venture, Mobile Drive, that will focus on delivering smart cockpit solutions for vehicles. This update comes after a Memorandum of Understanding (MOU) was initially signed on May 18, 2021.

Mobile Drive will be equally owned by Stellantis and FIH. The partnership has combined Foxconn’s capabilities in ICT industry and smart solutions, with Stellantis’ expertise in the automotive sector, ensuring the growth of Mobile Drive.

Mobile Drive will focus on developing infotainment and telematics solutions as well as a cloud service platform, which will aim to deliver a comprehensive smart cockpit solution. Its roadmap of software innovations will include artificial intelligence-based applications, navigation, voice assistance, e-commerce store operations, and payment services integration, amongst others. The hardware innovations will be related to the smart cockpit and telematics box.

Through the exchange of intellectual property by its founding entities and the vertical integration of respective supply chains, Mobile Drive will be able to create industry-leading automotive digital services to achieve a seamless user experience in and outside the vehicle. In the future, the smart cockpit solution will not only be available to all Stellantis vehicles, but also to third-party vehicle manufacturers, expanding the reach and impact of the Mobile Drive venture as it aims to be a global leader in smart cockpit and connected vehicle solutions.

 

Virtual Event - PowerUP Asia 2024 is coming (May 21-23, 2024)

Power Semiconductor Innovations Toward Green Goals, Decarbonization and Sustainability

Day 1: GaN and SiC Semiconductors

Day 2: Power Semiconductors in Low- and High-Power Applications

Day 3: Power Semiconductor Packaging Technologies and Renewable Energy

Register to watch 30+ conference speeches and visit booths, download technical whitepapers.

Subscribe to Newsletter

Leave a comment