The highest growing packaging segments were LGA and QFN followed by CSP/WLP in 2021

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The highest growing packaging segments were LGA and QFN followed by CSP/WLP in 2021 ForecastPro Updates included are the following: ForecastPro: Packaging Demand – v22.06 TechInsights’ packaging survey found a continuing shift towards leadless packages like QFN and LGA in 2021, especially in the analog space where the use of Flip chip/WLP packages has become […]

The highest growing packaging segments were LGA and QFN followed by CSP/WLP in 2021

ForecastPro

Updates included are the following:

  • ForecastPro:
    • Packaging Demand – v22.06

TechInsights’ packaging survey found a continuing shift towards leadless packages like QFN and LGA in 2021, especially in the analog space where the use of Flip chip/WLP packages has become common. They are replacing older package technologies, such as TSOP and SOIC, which continued to lose share. This shift is driven primarily by IoT and mobile devices, which have distinct packaging requirements in terms of footprint, thinness, and performance.

Packaging Upload

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