Proposed standardization of chiplet models for heterogenous integration

Download Sponsored By : Siemens
Proposed standardization of chiplet models for heterogenous integration

In this paper, the authors, as members of the Chiplet Design Exchange (CDX), propose a set of standardized chiplet models that include thermal, physical, mechanical, IO, behavioral, power, signal and power integrity, electrical properties, and test models, as well as documentation to facilitate the integration of the chiplets into a design. Additionally, security traceability assurance is an emerging need to ensure trusted supply chain and operational security of the chiplets and the resulting packaged devices. It is strongly recommended that these models are electronically readable for use in the design work flows.

The admin of this site has disabled the download button for this page.