3 High-Speed Design Challenges and How to Solve Them

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3 High-Speed Design Challenges and How to Solve Them

As you well know, there are plenty of challenges when it comes to designing high-speed electronic products.
High-speed busses such as PCI-Express, DDRx, and Serial ATA run at frequencies from several hundred megahertz to more than a gigahertz, making for tight timing margins. Fine-geometry silicon generates fast edge rates. And growing pressure for smaller and cheaper products leads to very dense PCB layouts. To implement a successful high-speed PCB design, all these factors must be taken into consideration.
This paper discusses three primary challenges involved with high-speed electronic product design: signal quality, timing, and crosstalk. By analyzing these areas, you can improve product reliability and quality and drive sensible decisions about trace length, topology, spacing and more.

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