Factorized Power Architecture: Achieving high density and efficiency in board mounted power

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As load currents continue to increase, Vicor has continued to enhance FPA to maximize current delivery and to further reduce density and the PDN to the point-of-load. Today Vicor offers a factorized Power-on-Package solution, consisting of MCDs and MCMs, where only the secondary side of the former VTM’s transformation stage is located at the point-of-load.

The regulation stage and the primary side of the VTM are now co-packaged into the MCD. The MCM can be mounted on the same package/substrate as the high-current processor. The MCD, as is the case with a PRM, can be mounted far away from the current-multiplier stage, using board real estate that is not as critical for density.

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