Factorized Power Architecture: Achieving high density and efficiency in board mounted power

Download Sponsored By : Vicor
Factorized Power Architecture: Achieving high density and efficiency in board mounted power

As load currents continue to increase, Vicor has continued to enhance FPA to maximize current delivery and to further reduce density and the PDN to the point-of-load. Today Vicor offers a factorized Power-on-Package solution, consisting of MCDs and MCMs, where only the secondary side of the former VTM’s transformation stage is located at the point-of-load.

The regulation stage and the primary side of the VTM are now co-packaged into the MCD. The MCM can be mounted on the same package/substrate as the high-current processor. The MCD, as is the case with a PRM, can be mounted far away from the current-multiplier stage, using board real estate that is not as critical for density.

The admin of this site has disabled the download button for this page.