Comchip adapted WLCSP technology in diode product (Wafer Level Chip Scale Package)

Download Sponsored By : Comchip
Comchip adapted WLCSP technology in diode product (Wafer Level Chip Scale Package)

Comchip was focus on ultra-small diode assembly technology development for a
decade. Now we are very happy to introduce the brand new ultra-small diode package
technology, so call Full-pack WLCSP. It’s the smallest diode in the world, DFN0402
(01005) package. Comchip’s WLCSP is a full package with 6 sides epoxy protection. It’s
different from normal WLCSP bare die parts or two side epoxy protection parts.

The admin of this site has disabled the download button for this page.